Fully-Automatic Chemical Mechanical Polisher
TPC-2110
This is fully-automatic CMP polishing equipment suitable for thin film (dielectric layer) and used for planarization polishing of oxides, metals, STI, SOI, MEMS and other products. This machine is compatible with 6/8” wafers, adopts a multi-zone airbag pressurization mode, and can achieve nanoscale precision removal. It also has double-sided scrubbing, mega-sonic cleaning, spin drying & N2 blow drying functions, and can realize fully-automatic dry-in and dry-out CMP processing. EPD functions such as friction, eddy current, and online infrared detection are optional.
Wafer Size6/8 inch
Number Of Plates1
Wafer Airbag Pressure0-700 g/cm2
Diameter of PlatesOD530 mm
